Consortium Members and Interested Persons:
The Consortium on
Deburring and Edge Finishing (CODEF) at the University of California
at Berkeley was formed over ten years ago to address problems related
to deburring and finishing of precision workpieces as well as develop
strategies, based on models of burr and breakout formation, to assist
the engineer in design and process planning to minimize or avoid burrs
altogether. This consortium is designed to be industry driven with an
emphasis on relevance to industrial problems and technology transfer.
The next meeting of the consortium is scheduled for Friday, February
28, 2003 and will be held on the University of California campus in
Berkeley. The meeting is designed to update member and interested companies
on recent progress and provide an opportunity to discuss research directions
and objectives. If you haven't attended earlier meetings this is a perfect
opportunity to join industry colleagues to hear about the work of the
consortium at Berkeley and jointly with industry. We have attached an
agenda for the meeting. Instructions for getting to Berkeley and area
hotels along with other meeting details are available on our website
http://lma.berkeley.edu under
CODEF.
The morning and early afternoon session of the meeting is open to all
attendees. There is a closed session for members only in the afternoon
but at that time we will have an informational session on the consortium
for those who are not familiar with our activities. CODEF members are
invited to informally present work in progress on burr issues in the
afternoon closed session.
To attend the meeting on February 28th in Berkeley please contact me
at (510) 642-0906, fax (510) 643-7463 or, preferably, by e-mail at dornfeld@me.berkeley.edu.
We can arrange parking as well with advance notice.
If you are unfamiliar with CODEF, we would be pleased to send background
information on CODEF and the Laboratory for Manufacturing Automation.
We look forward to hearing from you regarding the CODEF meeting at Berkeley
on February 28, 2003. We hope you can attend. Please feel free to extend
an invitation to attend to any other of your colleagues or other companies
you feel might be interested as well. Please have them contact me if
they are interested.
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Sincerely,
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David
Dornfeld
Professor of Mechanical Engineering and Director of CODEF
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