The Role of Complexing Agents in the Chemical Mechanical Polishing (CMP) of Copper Thin Films

Serdar Aksu

Sponsored By: SDU

Abstract

This project aims to delineate the role of complexing agents in the chemical mechanical polishing (CMP) of copper for integrated circuits (IC). The results will provide a fundamental understanding of solution and surface chemistry effects triggered by the use of complexing agents in the CMP process. This understanding will be used to formulate superior slurries for copper polishing.

 

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