Mechanical Properties and Relationship to Process Performance of the Polishing Pad in CMP 

 Yongsik Moon  

Sponsored By: NSF / UC-SMART 

Abstract 

It was verified in this study that the material removal rate was inversely proportional to the density of polishing pad. It was proportional to the compressibility of polishing pad and to the friction force between the workpiece and the polishing pad. Also, the roughness of the final surface depended on the mechanical properties of polishing pad.  

 

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