Identification of the Mechanical Aspects of Material Removal Mechanisms in Chemical Mechanical Polishing (CMP) 

 Yongsik Moon and Kori Bevans 

Sponsored By: NSF / UC-SMART 

Abstract 

Mechanical removal in CMP is isolated from chemical removal by using ‘abrasive-less’ slurry. It is believed that material properties, size, and geometry of abrasives have a strong effect on the mechanical removal, which is responsible for over 80% of total material removal.  

 

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