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1998 LMA Research Report Index

Download all 1998 Research Reports
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C. H. Chu

Integrated Design and Manufacturing for Milling Burr Minimization
Sponsored by:CODEF

  Exit Burr Minimization by Selecting Tool Feed Direction
Sponsored by:CODEF
  A Systematic Approach to Avoid Exit Burr in Milling
Sponsored by:CODEF
  Machine Learning Applied to Burr Type Prediction
Sponsored by:CODEF
J. Kim Control Chart of Drilling Exit Burr in Stainless Steel
Sponsored by:CODEF
  Geometric Characteristics of Drilling of Intersecting Holes
Sponsored by:CODEF
  Preliminary Experiment of Drilling Burr Formation in Titanium Alloy
Sponsored by:CODEF
J. Hewson Exit Burr Size and Shape in Backplate Assisted Drilling of Ti-6Al-4V
Sponsored by:CODEF
  Surface Roughness (Ra) Analysis in Dry Drilling of Ti-6Al-4V
Sponsored by:CODEF
S. Min Finite Element Modeling of Burr Formation in 2-D Orthogonal Cutting with a Backup Material
Sponsored by:CODEF
  Finite Element Modeling of Burr Formation in Drilling Based on 3-D Oblique Cutting Mechanism and CAD/FEA Integration for Drill Geometry Mesh Generation
Sponsored by:CODEF
H. Dechow Influence of Tool Geometry on Hole Quality when Drilling Ti-6Al-4V
Sponsored by:CODEF
  Investigation on the Improvements in Hole Quality when Reaming Ti-6Al-4V
Sponsored by:CODEF/MAPAL Dr. Kress KG, Germany


Y. Moon Investigation of the Relationship between Preston's Coefficient and Friction Coefficient in CMP
Sponsored by: NSF/UC SMART
  Mechanical Properties and Relationship to Process Performance of the Polishing Pad in CMP
Sponsored by: NSF/UC SMART
Y. Moon & Y. Lee Study of Slurry Chemical Influence in Ductile/Brittle Transition Depth in CMP Using Acoustic Emission Sensor
Sponsored by: NSF/UC SMART
Y. Moon The Effect of Slurry Film Thickness Variation in CMP
Sponsored by: NSF/UC SMART
Y. Moon & K. Bevans Identification of the Mechanical Aspects of Material Removal Mechanisms in CMP
Sponsored by: NSF/UC SMART
Y. Lee Open Architecture Control in Precision Machining
Sponsored by: Industrial Affiliates of the LMA/NSF
  Geometrical Effects of Abrasive Particles in CMP
Sponsored by: Industrial Affiliates of the LMA
  Probabilistic Analysis of Ductile/Brittle Transition in Diamond Turning of Brittle Materials
Sponsored by: Industrial Affiliates of the LMA
A. Chang Quality Oriented Process Planning for Precision Manufacturing
Sponsored by: Industrial Affiliates of the LMA/UC SMART
K. Bevans Trends in the Semiconductor Industry and the Role of Chemical Mechanical Planarization
Sponsored by: Competitive Semiconductor Manufacturing Program
J. Luo & Y. Moon Wafer-Scale Modeling of Chemical Mechanical Polishing (CMP) Process
Sponsored by: NSF
Y. Nakao & Y. Lee Ductile Regime Machining of Brittle Material by Single Point Diamond Turning Machining using AE Sensor Feedback
Sponsored by: Industrial Affiliates of the LMA
Y. Nakao Precision Control of Single Point Diamond Turning Machine using Intelligent Controller
Sponsored by: Industrial Affiliates of the LMA
Serdar Aksu The Role of Complexing Agents in the Chemical Mechanical Polishing (CMP) of Copper Thin Films
Sponsored by: SDU

 

 

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