LMA - 1998 Research Report Index

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1998 LMA Research Report Index

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C. H. Chu	Integrated Design and Manufacturing for Milling Burr Minimization Sponsored by:CODEF
	Exit Burr Minimization by Selecting Tool Feed Direction Sponsored by:CODEF
	A Systematic Approach to Avoid Exit Burr in Milling Sponsored by:CODEF
	Machine Learning Applied to Burr Type Prediction Sponsored by:CODEF
J. Kim	Control Chart of Drilling Exit Burr in Stainless Steel Sponsored by:CODEF
	Geometric Characteristics of Drilling of Intersecting Holes Sponsored by:CODEF
	Preliminary Experiment of Drilling Burr Formation in Titanium Alloy Sponsored by:CODEF
J. Hewson	Exit Burr Size and Shape in Backplate Assisted Drilling of Ti-6Al-4V Sponsored by:CODEF
	Surface Roughness (Ra) Analysis in Dry Drilling of Ti-6Al-4V Sponsored by:CODEF
S. Min	Finite Element Modeling of Burr Formation in 2-D Orthogonal Cutting with a Backup Material Sponsored by:CODEF
	Finite Element Modeling of Burr Formation in Drilling Based on 3-D Oblique Cutting Mechanism and CAD/FEA Integration for Drill Geometry Mesh Generation Sponsored by:CODEF
H. Dechow	Influence of Tool Geometry on Hole Quality when Drilling Ti-6Al-4V Sponsored by:CODEF
	Investigation on the Improvements in Hole Quality when Reaming Ti-6Al-4V Sponsored by:CODEF/MAPAL Dr. Kress KG, Germany

Y. Moon	Investigation of the Relationship between Preston's Coefficient and Friction Coefficient in CMP Sponsored by: NSF/UC SMART
	Mechanical Properties and Relationship to Process Performance of the Polishing Pad in CMP Sponsored by: NSF/UC SMART
Y. Moon & Y. Lee	Study of Slurry Chemical Influence in Ductile/Brittle Transition Depth in CMP Using Acoustic Emission Sensor Sponsored by: NSF/UC SMART
Y. Moon	The Effect of Slurry Film Thickness Variation in CMP Sponsored by: NSF/UC SMART
Y. Moon & K. Bevans	Identification of the Mechanical Aspects of Material Removal Mechanisms in CMP Sponsored by: NSF/UC SMART
Y. Lee	Open Architecture Control in Precision Machining Sponsored by: Industrial Affiliates of the LMA/NSF
	Geometrical Effects of Abrasive Particles in CMP Sponsored by: Industrial Affiliates of the LMA
	Probabilistic Analysis of Ductile/Brittle Transition in Diamond Turning of Brittle Materials Sponsored by: Industrial Affiliates of the LMA
A. Chang	Quality Oriented Process Planning for Precision Manufacturing Sponsored by: Industrial Affiliates of the LMA/UC SMART
K. Bevans	Trends in the Semiconductor Industry and the Role of Chemical Mechanical Planarization Sponsored by: Competitive Semiconductor Manufacturing Program
J. Luo & Y. Moon	Wafer-Scale Modeling of Chemical Mechanical Polishing (CMP) Process Sponsored by: NSF
Y. Nakao & Y. Lee	Ductile Regime Machining of Brittle Material by Single Point Diamond Turning Machining using AE Sensor Feedback Sponsored by: Industrial Affiliates of the LMA
Y. Nakao	Precision Control of Single Point Diamond Turning Machine using Intelligent Controller Sponsored by: Industrial Affiliates of the LMA
Serdar Aksu	The Role of Complexing Agents in the Chemical Mechanical Polishing (CMP) of Copper Thin Films Sponsored by: SDU

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