Characterization of CMP Polishing Pads Using Pyrene Fluorsence 

 Kori Bevans 

Sponsored By: CSM 

Abstract 

Pyrene fluorescence is used in determining the polarity of CMP polishing pads to quantify the pad?s interaction with the slurry. The pad, which acts as a gate for the delivery of chemicals to the surface of the wafer, has a significant effect on process performance variation.  

 

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