Yoon Lee and Andrew Chang
Sponsored
By: LMA Affiliates
Abstract
Fabrication of high-quality optical lenses and reflectors demands the ultraprecision
cutting of materials using micron to submicron uncut chip thicknesses (ac). At this scale, surface
topography is significantly influenced by the interaction between the cutting tool and grain
orientation/boundary effects. In this study, micro-scratching tests on coarse-grained,
oxygen-free, high-conductance (OFHC) copper were performed with an increasing depth of cut,
and the topography of the surfaces was characterized. The results were in agreement with
previous work performed by other researchers. Acoustic emission (AE) was used to monitor the
cutting process..
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