Integrated Model for the Chemical-Mechanical Polishing Based on A Comprehensive Material Removal Model  

  Jianfeng Luo 

Sponsored By: UC SMART/NSF  

Abstract 

The architecture of an integrated model for chemical mechanical polishing is proposed in this report. For details on the report, the readers are referred to J. Luo, D. Dornfeld, Z. Mao et. al. ' Integrated model for the chemical-mechanical polishing based on a comprehensive material removal model,' Six International VMIC conference, March, 2001.  

 

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