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  Material Removal Saturation in Chemical Mechanical Polishing with Abrasive Weight Concentration: Effects of Abrasive Size and Wafer-Pad Contact Area  

  Jianfeng Luo 

Sponsored By: UC SMART/NSF 

Abstract 

The material removal rate as a function of abrasive weight concentration has been proposed. With the increase of the concentration, three regions of material removal exist, first the chemical dominant region, where the abrasive weight concentration is quite small, second the mechanical dominant region, where the material removal increases linearly with the weight concentration, and third the mechanical dominant saturation region, where the material removal no longer increases with the weight concentration because the contact area is fully occupied by the abrasives. In the model, a fitting parameter is used to represent the effect of chemical dominant region. The slope of material removal increase in the linear region is a function of abrasive size distribution. The saturation removal rate in the saturation region is a function of abrasive size distribution too based on our model. The verification of the MRR formulation in these two regions clarifies the roles of contact area and abrasive size distribution in the developed material removal model. (for details on this report, the readers are referred to J. Luo and D. A. Dornfeld, "Material removal saturation in CMP with abrasive weight concentration: effects of abrasive size and wafer-pad contact area," ESRC report (2000-10), UC Berkeley, 2000)  

 

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