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  Improvement of Non-Uniformity (NU) in Chemical-Mechanical Polishing (CMP) from the Viewpoint of Consumable Effects Based on a Developed Material Removal Model  

  Jianfeng Luo 

Sponsored By: UC SMART/NSF;

Abstract 

Controlling/designing the consumable parameters is a possible way to optimize the non-uniformity in CMP, and may be a better choice than the conventional method of adding dummy structures with the decrease of the feature size in ICs and higher requirements on the circuit performance. In this report, the motivation for improving NU by adjusting consumable parameters are discussed. Details on this report can be found in J. Luo and D. A. Dornfeld, "Improvement of NU in CMP from the viewpoint of consumable effects based on a developed material removal model," ESRC reports, UC Berkeley, 2000.  

 

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