On the Abrasive Particle Settling Mechanisms in Chemical Mechanical Polishing (CMP) 

  Zhoujie Mao 

Sponsored By: LMA 

Abstract 

In a CMP process, the slurry is used both as a chemical reaction agent and as a carrier of abrasive particles. This research focuses on the behavior of the abrasive particles in the slurry as a first step to better understand the role of slurry in the material removal process and the efficiency of slurry usage in CMP. 

 

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