LMA - 2000 Research Report Index

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2000 LMA Research Report Index

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E. Chibesakunda	Parametric Cost Model for Deburring Processes Sponsored by: CODEF
	Coupling Cost Model (CCM) Sponsored by: CODEF
S.Kumar	Basic Model for Burr Prediction System Sponsored by: CODEF
K.Lee	Case Study: Burr Formation in Turning of Brass Workpiece with Pockets Sponsored by: CODEF, MRC Bearings
K.Lee, S.Min, W.M.Fong	DBES: An Internet-Based Drilling Burr Expert System Sponsored by: CODEF
K.Lee, B.Stirn, I.Essel	Burr Formation in Micro-Machining Sponsored by: CODEF
K.Leis	Burr Formation in Drilling Intersecting Holes Sponsored by: Daimler Chrysler
E.Meum	Development of Burr Measurement System Sponsored by: CODEF
S.Min	Three-Dimensional Finite Element Modeling of Drilling Burr Formation Part 1: Modelling Sponsored by: CODEF
	Three-Dimensional Finite Element Modeling of Drilling Burr Formation Part 2: Modelling Sponsored by: CODEF
A.Rangarajan	Tool Path Planning Based on Feature Priorities Sponsored by: CODEF
	Tool Entrance/Exit Condition Sponsored by: CODEF
B.Shyu	Finite Element Simulation for Burr Formation Study Sponsored by: CODEF
B.Stirn	Study of Burr Formation in Micro-drilling Sponsored by: CODEF
H.Storhaug	Linking Edge Quality to Part Functionality Sponsored by: CODEF

Professor David Dornfeld	Mechanical Aspects of CMP University of California, Berkeley
A. Chang	The Effect of Slurry Film Thickness Variation in Chemical Mechanical Polishing(CMP) of Patterned Oxide Wafers Sponsored by: NSF/UC SMART
	Simulation Software Tools for CMP Modeling Sponsored by: LMA Industrial Affliates/ UC URO Program
E. Hwang	Fixed Abrasive Design Sponsored by: UC SMART
	Investigation of Material Removal Mechanisms in Oxide CMP by Scratch Test Sponsored by: UC SMART
P.Joergensen, H.Passman	Energy Consumption Model for Semiconductor Manufacturing Equipment Sponsored by: Applied Materials
N.Krishnan	The Environmental Value Systems (EnV-S) Analysis Sponsored by: Applied Materials, NSF/SRC
J.Luo	Integrated Model for the Chemical-Mechanical Polishing Based on a Comprehensive Material Removal Model Sponsored by: NSF/UC SMART
	Material Removal Saturation in Chemical Mechanical Polishing with Abrasive Weight Concentration: Effects of Abrasive Size and Wafer-Pad Contact Area Sponsored by: NSF/UC SMART
	The Effects of Abrasive Size Distribution in Chemical-Mechanical Polishing: Modeling and Verification Sponsored by: NSF/UC SMART
	Improvement of NU in CMP from the Viewpoint of Consumable Effects Based on a Developed Material Removal Model Sponsored by: NSF/UC SMART
Z. Mao	On the Abrasive Particle Settling Mechanisms in Chemical Mechanical Polishing (CMP) Sponsored by: Industrial Affiliates of the LMA
G. Mastrolilli	Study of Grain Boundary and Orientation Effect in Precision Machining Using Acoustic Emission and Force Sensors Sponsored by: Industrial Affiliates of the LMA

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