A Macroscopic Model for CMP 

 Zhoujie Mao 

Sponsored By: NSF 

Abstract 

An integrated model for CMP will be discussed in this research. Both a macroscopic model and microscopic models will be discussed. Attempt is also made to connect macroscopic behavior to microscopic behavior such that the process can be controlled to improve the performance.

Keywords: chemical mechanical polishing, lubrication regime, material removal. 

 

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