End-point detection in the CMP process: review of current approaches 

 Edward I. Hwang 

Sponsored By: UC SMART and Applied Materials 

Abstract 

This paper aims at reviewing current approaches for in-situ end-point detection in CMP. Three different processes for which end-point detection is used are classified: copper damascene, shallow trench isolation, and inter-level dielectric.

Keywords: End-Point Detection, CMP, Copper Damascene, STI, and ILD. 

 

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