Edward
I. Hwang
Sponsored
By: UC SMART and Applied Materials
Abstract
As
a new method for in-situ end-point detection in CMP, an acoustic emission
(AE) sensor is chosen because of its high sensitivity and high signal
to noise ratio in the sub-micron range. The time-based analysis technique
based on root-mean-square (RMS) shows that hardness of materials polished
is reflected in the level of AE signals. Tests are done for copper damascene
and shallow trench isolation processes.
Keywords:
End-point detection, CMP, acoustic emission, hardness
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