Sunghoon
Lee and Edward Hwang
Sponsored
By: UC SMART
Abstract
There
are many factors affecting CMP performance, among which slurry, pad,
and pad conditioning have been the mainstreams of researchers in this
area. As wafer size increases, new polishing mechanisms and different
wafer designs have begun to be considered as well. Even though the polishing
pad itself has developed considerably in terms of materials properties
or issues related to the process over the last 20 years, the basic underlying
concept is more or less the same as before. Hence, in order to address
the ever-increasing demands of the current semiconductor industry, the
SMART pad, a new concept pad, is suggested here to improve CMP performance.
Chemical
mechanical polishing (CMP), SMART Pad.
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