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 Material Removal Regions in Chemical Mechanical Polishing: Coupling Effects of Slurry Chemicals, Abrasive Size Distribution and Wafer-Pad Contact Area, Part 2 

 Jianfeng Luo 

Sponsored By: NSF and UC SMART 

Abstract 

Three regions of material removal with the increase of abrasive weight concentrations have been proposed in the first part of this paper [1]. The transition of the regions and the corresponding material removal rate formulations are functions of slurry chemicals, abrasive size distribution and wafer-pad contact area. In this paper, experimental evidence supporting the proposed model and formulations is discussed. Further experimental results supporting the model from other aspects in the future can help a better understanding on the chemical-mechanical polishing and its optimization.

Keywords: abrasive size distribution, chemical-mechanical polishing, material removal rate, passivation, slurry. 

 

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