A Study on Pad Surface Characterization and Design for Chemical Mechanical Polishing (CMP)
-Fabrication Process and Prototype -

Sunghoon Lee
Sponsored by UC SMART

Abstract- There are many elements affecting CMP performance such as slurry, pad, process parameters and pad conditioning. Among these elements, the pad is considered one of the most important because of its deterioration during polishing. A special purpose pad design, however, has not been tried yet. In this paper, a fabrication process and prototype are detailed using micro molding technology. These are applied to pad design optimization.

Keywords: Chemical mechanical polishing (CMP), micro molding, pad design.

 

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