Review of Chemical-Mechanical Planarization Modeling for Integrated Circuit Fabrication: From Particle Scale to Die and Wafer Scales

Jianfeng Luo
Sponsored by NSF and UC-SMART

Abstract- Modeling and simulation are critical to transfer CMP from an engineering 'art' to an engineering 'science'. Research efforts in CMP modeling have been attempted in the last decade. There is an urgent need to review the current models including their limitations and future research directions systematically. In this paper, chemical mechanical planarization modeling is reviewed systematically, from particle scale to die and wafer scales.

Keywords: CMP modeling, IC fabrication, particle scale, die scale, wafer scale.

 

 

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