LMA - 2000 Research Report Index

Laboratory for Manufacturing Automation

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2002 LMA Research Report Index

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Miguel C. Avila	The Effect of Kinematical Parameters and Tool Geometry on Burr Height in Face Milling of Al-Si Alloys Sponsored by: CODEF
Alexander Balduhn	Model of a Burr Expert System Sponsored by: CODEF
Jihong Choi and Sangkee Min	Modeling of Inter-Layer Gap Formation in Drilling of a Multi-Layered Material Sponsored by: CODEF
Kiha Lee	Micro-Burr Formation and Minimization through Process Control Sponsored by: CODEF
Prabhu Ramachandran	Feasible Offset Region Based Tool Path Planning for Face Milling Sponsored by: CODEF
Arvind Rangarajan	Probabilistic Precision Process Planning- P4 Sponsored by: CODEF
	White Paper on Technical Software Integration Sponsored by: CODEF
	Determining Statistically Significant Parameter Regions for Bounded Specification Sponsored by: CODEF

Uday Ayyagari , Nikhil Krishnan and Joaquin Rosales	Integrated Life-cycle Assessment for semiconductor manufacturing processes using the Environmental Value Systems Analysis and EIOLCA Sponsored by: NSF/SRC and Applied Materials
Peter Broomes	HVAC Modeling for Cost of Ownership Assessment in Biotechnology & Drugs Manufacturing Sponsored by: LMA
Nikhil Krishnan and Uday Ayyagari	The Environmental Value Systems Analysis - Research Report for 2002 Sponsored by: NSF/SRC and Applied Materials

Edward Hwang	MEMS Applications of CMP Sponsored by: UC SMART
	Design Rules for the Development of a New-Concept Pad Sponsored by: UC SMART
Christian R. Keppeler	Micromilling for Mold Fabrication Sponsored by: LMA
Sunghoon Lee	A Study on Pad Surface Characterization and Design for Chemical Mechanical Polishing (CMP)-Fabrication Process and Prototype Sponsored by UC SMART
Jianfeng Luo	Review of Chemical-Mechanical Planarization Modeling for Integrated Circuit Fabrication: From Particle Scale to Die and Wafer Scales Sponsored by NSF and UC-SMART
	Wafer-Scale CMP Modeling of With-in Wafer Non-Uniformity Sponsored by NSF and UC SMART
C.M.O. Valente	Using Graphical Analysis of Acoustic Emission Sponsored by Industry Affiliates of the LMA

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